Cover Glass

CNC Cutting/CNC Carving

Application: cutting protection of all kinds of wafer, glass and circuit board in the manufacturing process of electrical or electronic parts

UV Dicing Film

• Special design and formulations with UV based adhesive, 

• It can be automatically separated from the adhesion surface after being exposed to ultraviolet radiation.

Application: Temporary fixation for all kinds of electronic parts manufacturing process

Thermal Release Tape

•It could perform normal adhesion at room temperature while be peeled off after heating.
• Specific release temperature could be designed to improve production efficiency.

OGS Reinforcement & Ultrasonic Cleaning

Application：Protection for touch panel OGS reinforcement process

Acid Resistant Protective Film

• Hydrofluoric acid resistance,
• Excellent adhesion and peeling properties, Leave no residue.

PVD Coating & Screen-Printing Process

Application：Printable ink protection in glass cover plate process or ITO film process 

Heat Resistance Film

• High temperature (160℃) resistance,
• Stable peeling after high temperature with no residue,
• PET shrinkage rate of MD/TD can be adjusted to meet customer process.